Abu dhabi: EDGE and ICAPE Group today signed a Memorandum of Understanding at Make it in the Emirates (MIITE 2026), signalling a shared intent to pursue joint development and the localisation of key electronic subsystem supply in the UAE. The agreement aims to strengthen their collaboration and establish a framework for embedding ICAPE Group's expertise in PCBs turnkey solutions and electronic components within EDGE Group's manufacturing operations.
According to Emirates News Agency, the MoU marks a formal next step in an established commercial relationship between the two entities. Hamad Al Marar, Managing Director and CEO of EDGE Group, expressed the significance of the partnership, highlighting the global expertise that ICAPE Group brings in PCBs, turnkey solutions, and electronic components. He emphasized that the MoU sets a joint ambition for local development and supply.
With the projected increase in demand for electronic components, printed circuit boards, and turnkey solutions across EDGE's product portfolio, establishing a localised and resilient supply chain for critical subsystems is a strategic priority. Yann Duigou, CEO of ICAPE Group, also expressed pride in the agreement, emphasizing ICAPE's commitment to quality and delivery in servicing a leading and fast-growing group like EDGE, which is recognized as a major player in the defence sector.